BSP exploits full power of NXP's ARM9 MCU

Board support package supports all key features of the LPC3180, including optimised power management and the ARM VFP vector floating point library for CE 6.0.

Adeneo has announced today the full commercial release of the Windows Embedded CE 6.0 board support package for the NXP LPC3180 ARM9-processor-based microcontroller.

This BSP runs on the phyCore LPC3180 board, a standard development platform from Phytec.

It supports all key features of the LPC3180, including optimised power management and the ARM VFP vector floating point library for CE 6.0.

A binary evaluation version is available free of charge for testing and demonstration purposes.

And OEMs wanting to perform in-depth evaluation and qualification of the Adeneo BSP can obtain a free 20-day evaluation licence under NDA.

Adeneo also provides the complete source code for commercial designs via an attractive one-time licence, without royalties.

Yannick Chamming, General Manager of Windows Embedded activity at Adeneo, and CEO of Adeneo America says: "We've been working with NXP and Phytec for many months now to release a strong and reliable Windows Embedded CE solution for the LPC3180 platform".

"By providing this new solution to market, as well as our expertise to OEMs through consulting, training and turnkey developments on Windows Embedded CE, we provide a key solution to help securing designs in the best time to market".

Geoff Lees, Product Line Manager at NXP, adds: "Today's embedded developers demand more from the hardware and software systems".

"With this version of WIN CE 6.0 supporting VFP and Adeneo's expertise, our customers can reach the full potential of the LPC3000 family".

Jeff Felbeck, Senior Partner Marketing Manager, Windows Embedded Business, Microsoft Corp, adds: "Adeneo's close collaboration with NXP and Phytec is a great example of leveraging core competencies to very positive effect".

"Adeneo's proven BSP development capabilities greatly help ensure driver quality, which is a critical component in gaining time to market advantage".

Because of its compliance with Microsoft PQOAL (Production-Quality OEM Adaptation Layer) and PQD (Production Quality Device) specifications, the new BSP is the most cost-effective way to develop custom solutions on NXP chips under Windows Embedded CE with the minimal redesign.

Only the portions of the BSPs handling board features need to be reviewed and redesigned, and all code linked to the core CPU can be reused without modifications.

The BSP includes drivers for most of the peripherals integrated in LPC3180 chips, including USB, serial, SPI, I2C, as well as key features of the chip such as power management and vector floating point support.

The BSP has been qualified using the Windows Embedded CE official test kit, and has been designed to take full advantage of the advanced features of the LPC3180 such as advanced power management for both idle and suspend mode.

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