Product category:
Programmable Logic Devices
News Release from: Altera Europe | Subject: Cyclone II
Edited by the Electronicstalk Editorial
Team on 15 September 2005
Packages shrink FPGA sizes and costs
New packaging options for the low-cost Cyclone II FPGA family provide designers of high-volume applications with even lower-cost programmable solutions and smaller form factors.
Altera has introduced new packaging options for its low-cost Cyclone II FPGA family, providing designers of high-volume applications with even lower-cost programmable solutions and smaller form factors The new packages meet the needs of customers who are designing Cyclone II devices into low-cost applications never before addressed by FPGAs
This article was originally published on Electronicstalk on 26 Mar 2008 at 8.00am (UK)
Related stories
FPGAs find even smaller packages
Package offers the highest amount of logic and I/Os for the footprint, allowing engineers to use FPGAs in new applications.
FPGAs are ideal for video processing
Kit supports multiple video I/O formats, allowing video application developers to quickly develop, debug, and prototype designs using their lab video signals and displays.
The Cyclone II EP2C20 device is now available in the low-cost 240-pin quad flatpack (QFP) package, and the EP2C35 and EP2C50 devices are available in the 19 x 19mm, small form factor 484-pin Ultra FineLine BGA (UFBGA) package.
"Altera maintains close working relationships with its customers from the product definition stage through when a new device family begins shipping".
"This enables us to learn the most about how our devices are being used and which features customers need most", said Steve Mensor, Altera's Senior Director of Product Marketing for Low-Cost FPGAs.
"As more Cyclone II devices are being adopted into high-volume applications, the availability of the QFP and UFBGA packages will allow designers to realise lower total costs and to fit more functionality into a smaller board area".
The QFP package is designed for easier PCB assembly, resulting in significant cost savings for Cyclone II users.
The EP2C20 device in the 240-pin QFP package has 142 user I/O pins and is the optimal low-cost package for PCBs with few board layers.
The UFBGA's 0.8mm ball pitch allows for a significantly smaller device footprint - 30% smaller than the equivalent 1.0mm ball pitch BGA package - while still providing over 50,000 logic elements for designers.
• Altera Europe: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
