Product category:
Communications ICs (Wireless)
News Release from: Agere Systems | Subject: AGRA10, AGR09030, AGR09045, AGR09060 and AGRB10
Edited by the Electronicstalk Editorial
Team on 24 March 2004
Plastic packages cut RF transistor costs
Five new high-performance overmoulded plastic packaged transistor products reduce the costs of RF transistor packaging up to 25%.
Five new high-performance radio frequency (RF) overmoulded plastic packaged transistor products reduce the costs of RF transistor packaging up to 25% Agere's new solutions will lower the overall costs and accelerate deployment of a vast array of wireless basestation amplifier equipment
This article was originally published on Electronicstalk on 8 Mar 2007 at 8.00am (UK)
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The plastic-encased transistors are used in wireless basestation amplifiers, which rank among the most expensive components in a wireless basestation.
Furthermore, Agere's new products are lead-free, which reduces risks of environmental effects of the substance - a major concern in today's RF transistor market.
They also are capable of continuous operation at a 200C junction temperature.
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Agere's five overmoulded plastic packaged transistors adhere to several of the world's most widely used wireless standards.
"The cost benefits of plastic RF transistors compared with ceramic ones are remarkable and undeniable", said Jagdish Rebello, PhD, analyst with iSuppli Corp.
"A new family of products that decreases costs of wireless equipment, and thereby wireless services, positions Agere well as the widespread transition to plastic continues".
"This announcement represents the third major one since Agere entered the RF transistor market last year", he added.
"Agere announced its entry into the business last year with cooling capabilities for basestations.
And now they are announcing availability of a large number and wide range of plastic RF transistors".
Ceramic, a more expensive material than plastic, has been the main substance used with RF transistors for several years.
RF transistor providers are transitioning to plastic because of cost and price pressures throughout the wireless industry.
"Wireless infrastructure equipment manufacturers are facing extreme pressure to reduce capital and operational costs", said Carlos Garcia, Vice President with Agere Systems.
"These demands drive the urgent need for such lower-priced RF power technology as plastic RF transistors.
To build on our exciting momentum in the RF market, we are rolling out this new product family - squarely addressing what our customers need most".
The following Agere chips are being offered with overmoulded plastic packaging: AGRA10, AGR09030, AGR09045, AGR09060 and AGRB10.
The first four listed can be used across frequencies ranging up to 1GHz.
The AGRB10 can be used in frequencies spanning 1 to 2.7GHz.
These five new LDMOS devices range in power from 10 to 60W.
Agere's new line of transistors is sampling now and will be available in production quantities by May 2004.
The transistors range in price from $8.50 to $32 in quantities of 10,000.
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