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Camera modules aim for 3G handsets

An Avago Technologies product story
Edited by the Electronicstalk editorial team Apr 18, 2003

Agilent Technologies has a new family of fully integrated CMOS camera modules that can be easily designed into mobile phones and wireless PDAs.

Agilent Technologies has a new family of fully integrated CMOS camera modules that can be easily designed into mobile phones and wireless PDAs.

The new camera modules offer exceptional sensitivity for capturing great images in low-light conditions.

Because they are fully integrated and require no external components, the new modules reduce time to market.

New camera-enabled mobile applications such as MMS (multimedia messaging), visual caller ID and mobile photo albums are now beginning to roll out to consumers.

As the popularity of these imaging-based applications spreads, mobile imaging will become an essential feature.

Agilent's new camera modules combine high image quality CIF or VGA resolution CMOS image sensors with a tightly integrated image processor, an embedded power supply and high-quality lens to offer a complete imaging solution.

Their miniature size allows the addition of a camera module in even the smallest applications.

The Agilent ADCM-1650 and ADCM-1670 camera modules offer CIF (352 x 288 pixel) resolution, and the ADCM-2650 provides VGA (480 x 640 pixel) resolution.

CIF resolution is recommended for phone-to-phone use, while VGA resolution is suggested for phone-to-web and phone-to-email applications.

Agilent's CMOS camera modules use a proprietary low noise imaging-optimised IC process and innovative analogue circuitry for very high sensitivity pixel designs that enable enhanced low-light performance.

This allows great pictures to be taken even under dimly lit conditions.

The new camera modules also incorporate low power internal voltage regulation for optimum power management.

The Agilent ADCM-1650, ADCM-1670 and ADCM-2650 are available for sampling.

Production volumes are expected to be available in April 2003.

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