Product category:
Frequency Control Components
News Release from: Avago Technologies | Subject: FBAR Microcap filters
Edited by the Electronicstalk Editorial
Team on 04 March 2004
FBAR filters shrink into GSM RF front
ends
Agilent Technologies is shipping samples of the industry's smallest filters to select manufacturers for integration into GSM RF front-end modules.
Agilent Technologies is shipping samples of the industry's smallest filters to select manufacturers for integration into GSM RF front-end modules Because of the small size and superior thermal performance of Agilent's film bulk acoustic resonators (FBARs), filters can now be incorporated into front-end modules, including transceiver modules
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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Agilent's FBAR filters use the company's Microcap bonded wafer chip-scale technology to create the industry's smallest RF filter.
GSM transceiver and switch module manufacturers are attempting to reduce thickness from about 1.6mm today to about 1.0 to 1.2mm in the future.
At 0.3mm high, Agilent's bumped FBAR Microcap filters enable this reduction.
In addition, with a temperature coefficient of -25ppm/C, FBAR filters have only 60% the temperature sensitivity of surface acoustic wave (SAW) filters, making them a better choice for modules densely populated with heat sources such as transceivers or power amplifiers.
The resulting thin, small, highly integrated modules accelerate time to market for handset manufacturers and make room for additional handset features, such as camera modules, GPS locators, and infrared and Bluetooth connectivity.
Agilent's FBAR filters are built with the company's innovative Microcap bonded-wafer chip scale technology.
This process produces the industry's smallest individually sealed filters in a bumped Microcap die.
This breakthrough resonator technology is displacing ceramic dielectric filters and SAW filters.
Key comparisons between FBAR filters and SAW filters include: 0.3mm height, compared with 0.6 to 0.8mm height of SAW filters; PCS/DCS footprint of 0.5 to 1.0mm square, compared with 3.2mm for SAW filters; cell/EGSM footprint of 1.0 to 2.0mm square compared with 3.2mm for SAW filters; and the silicon fabrication of FBAR filters enable chip stacking on silicon transceivers which is not possible with SAW filters.
The new Microcap chip-scale FBAR filters are shipping in prototype quantities to select module manufacturers.
They are expected to ship in volume in Q3 2004. Request a free brochure from Avago Technologies ...
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