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Product category: Analogue and Mixed Signal ICs
News Release from: Avago Technologies | Subject: AMMP series
Edited by the Electronicstalk Editorial Team on 23 July 2004

MMICs packaged for surface-mount
production

The AMMP series of millimetre-wave integrated circuits is packaged in an innovative 5 x 5mm low-cost surface-mount package compatible with automated assembly techniques.

The AMMP series of millimetre-wave integrated circuits is packaged in an innovative 5 x 5mm low-cost surface-mount package compatible with automated assembly techniques These packaged parts allow customers to move the entire radio frequency (RF) block diagram to lower-cost, surface-mount manufacturing rather than continue with more costly chip and wire assembly manufacturing that requires complex tuning and assembly processes

Surface-mount packaging offers performance comparable to "bare die" millimetre-wave ICs.

This series of surface-mount millimetre-wave ICs, from Agilent's Semiconductor Products Group, fills virtually all the active RF requirements of point-to-point and point-to-multipoint microwave links.

These applications include IEEE802.16 broadband wireless access and IEEE802.20 mobile broadband wireless access, wireless local loop (WLL), multipoint microwave distribution system (MMDS, also known as wireless cable), and other cost-sensitive commercial communications systems operating from 6 to 20GHz.

The AMMP series of packaged millimetre-wave IC devices are compatible with high-volume, surface-mount PCB assembly processes, including pick-and-place and reflow soldering.

The backside of the surface-mount ceramic package is both RF and DC ground, which helps simplify the assembly process and reduces assembly-related performance variations and costs.

The initial products to be offered include the following devices.

The AMMP-5618 is a 6 to 20GHz general-purpose amplifier with 19dBm output power and 13dB gain.

It includes an efficient two-stage amplifier designed for use as a cascadable intermediate gain block for applications, including LO buffer or transmit driver amplifier.

The AMMP-6530 is a 5 to 30GHz image reject mixer (5 to 30GHz LO and RF, DC-5 GHz IF) featuring -7dB conversion loss and 15dB image suppression.

The design combines passive FET mixing and integrated Lange coupler.

The AMMP-6420 is a 6 to 18GHz high-gain 1W power amplifier.

It features partial input and output match to 50ohm and unconditional stability.

Gate voltage can be optimised for linear or saturated operation, and a reference and output detector provides output power detection over a 15dB range.

The AMMP-6220 is a 6 to 20GHz low-noise amplifier featuring 2.2dB noise figure and 23dB gain.

The amplifier has fully integrated input and output DC blocking capacitors, bias choke, and single supply self-bias.

The AMMP-6120 is a 6 to 20GHz times-two frequency multiplier.

This device takes a 3 to 10GHz input signal and doubles it to 6 to 20GHz with integrated amplification, matching, harmonic suppression and bias network.

Samples of the AMMP series packaged millimetre-wave ICs are available now through Agilent's direct sales channel.

Production quantities and full availability through Agilent's worldwide distribution partners is expected in the fourth quarter of 2004. Request a free brochure from Avago Technologies ...

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