RGB LED slims for colourful backlighting

The industry's thinnest top-firing tricolour surface-mount LED is intended primarily for backlighting and status indicators in ultrathin feature-rich mobile phones and PDAs.

Agilent Technologies has introduced the industry's thinnest top-firing tricolour surface-mount LED (light-emitting diode), intended primarily for backlighting and status indicators in ultrathin feature-rich mobile phones and PDAs.

The new top-firing LED, in addition to Agilent's recently announced side-firing LEDs, permits handset and PDA designers to mix separate red, green and blue light sources in any combination.

In handsets and other handheld devices, separate colours can indicate incoming SMS (short messaging system) messages, e-mail and stock news.

They can even identify different callers.

The availability of an unlimited range of illumination colours also provides a new degree of design flexibility in many other applications, such as backlighting and status indication in office and industrial equipment and home appliances.

The Agilent HSMF-C114 tricolour chip-type LED features a four-terminal common anode connection and is housed in Agilent's miniature 1.6 x 1.5 x 0.35mm package.

Precision manufacturing techniques ensure perfect pickup by automated manufacturing equipment.

The HSMF-C114 combines: InGaN blue (470nm dominant wavelength, 70mcd typical brightness at 20mA operating current); InGaN green (525nm dominant wavelength, 180mcd typical brightness); and AlInGaP red (626nm, 85mcd) die.

The LED features diffused optics, is compatible with IR reflow soldering processes, and is certified lead-free.

Agilent's ChipLED package features high thermal dissipation capability for maximum reliability.

The Agilent HSMF-C114 ChipLED devices are available now through Agilent's direct sales channel and worldwide distribution partners.

ChipLED devices are shipped with EIA481-compliant standard packaging: 8mm carrier tape on 7in-diameter reel and sealed in moisture barrier bags.

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