Product category:
Light Emitting Diodes (LEDs)
News Release from: Avago Technologies | Subject: ASMT-Rx45 series
Edited by the Electronicstalk Editorial
Team on 24 May 2007
Slimline LED chips are brighter choice
Low-power high-brightness leadframe ChipLEDs are designed to operate in the extreme conditions found in automotive, electronic sign and signals and industrial applications.
Avago Technologies has introduced the industry's thinnest chip light emitting diodes (ChipLEDs) in the smallest industry-standard package With an ultrasmall form factor of 1.65 x 0.8 x 0.45mm, Avago's new ASMT-Rx45 series of low-power high-brightness leadframe ChipLEDs have been specifically designed to operate in the extreme conditions found in automotive, electronic sign and signals (ESS) and industrial applications
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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Avago's ultrathin ASMT-Rx45 aluminium indium gallium phosphide (AllnGaP) ChipLEDs were developed based on the industrial standard ChipLED 0603 platform which requires less board space and provides designers with a 20 to 30% cost savings over industry-standard PLCC-based LEDs.
Moreover, these ChipLEDs provide a wide viewing angle of 130 degrees to improve visibility in bright sunlight.
Available in red, red-orange, orange, and yellow to yellow green colours, the ASMT-Rx45 series is ideal for use by lighting designers developing backlighting for dashboards and entertainment consoles in automobiles, backlighting of industrial switches and buttons, and small pixel indoor signs.
In addition to the high brightness and compact size, Avago's ASMT-Rx45 ChipLEDs provide two significant advantages in the production environment: They can be easily soldered using conventional surface mount techniques to minimise production costs, and the package is qualified to a Joint Electronic Device Engineering Council (JEDEC) moisture sensitive level (MSL) rating of 2a.
For manufacturers, this rating means that these ChipLEDs can be kept in the open air (30C, 60% relative humidity) for up to four weeks after being removed from its sealed package without the need to remove absorbed moisture.
The AllnGaP technology incorporated in Avago's ASMT-Rx45 package offers low thermal resistance, which allows more efficient heat transfer from the package to the motherboard thereby maintaining long-term device reliability.
With its robust MSL 2a moisture sensitivity rating, designers will have greater flexibility during assembly of their products.
Samples and production quantities are available now through Avago's direct sales channel and worldwide distribution partners. Request a free brochure from Avago Technologies ...
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