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Test Accessories
News Release from: Agilent Technologies Europe | Subject: DDR BGA probe
Edited by the Electronicstalk Editorial
Team on 29 January 2008
Probe meets demands of faster DRAM
Agilent's new DDR BGA probe provides direct access to the balls of the DRAM with low loading and minimal impact to signal integrity.
Agilent Technologies has released the industry's first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analysers Dynamic random access memory (DRAM) data rates have increased significantly over the past few years
This article was originally published on Electronicstalk on 28 Sep 2006 at 8.00am (UK)
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Hence, the signals are now operating at a faster speed in a smaller package, which requires a more reliable tool for validating the memory systems.
Agilent's new DDR BGA probe provides direct access to the balls of the DRAM with low loading and minimal impact to signal integrity.
The probes are used with the oscilloscopes and logic analysers to perform physical layer and functional test.
The Agilent DDR2 and DDR3 BGA probes provide signal access points to the clock, strobe, data, address and command signals of the DDR3 DRAM for true compliance testing with an oscilloscope.
The logic analyser provides timing and protocol view of the DRAM activities.
The DDR2 BGA probe enables simultaneous access to the oscilloscope and to the logic analyser's full compliance and protocol validation.
"Engineers need to access memory buses with measurement tools that provide high signal integrity performance and protocol validation", said Sigi Gross, Vice President and General Manager of Agilent's Digital Test Division.
"Both the DDR2 and DDR3 BGA probe adapters meet their needs".
"We are ready with the tools -- including the DDR3 test application we released recently -- that will help engineers validate their designs quickly and easily".
The DDR2 BGA probe provides probing of x8 and x16 DRAM packages.
W2631A and W2632A models, when combined with Agilent's E5384A and E5826A logic analyser adapters, support command and data probing for x16 packages.
W2633A and W2634A models provide access to command and data buses for x8 packages.
When used with high-bandwidth solder-in InfiniiMax probes, all four DDR2 BGA probe variants allow probing with the oscilloscopes.
The DDR3 BGA probe supports different packages.
The W2635A x8 BGA probe provides support for x4 and x8 DRAM package.
The W2636A x16 BGA probe adapter provides support for x16 DRAM package.
Each comes in 10 and 11mm widths to satisfy the different spacing requirements between DRAM chips.
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