Product category:
ATE Systems
News Release from: Agilent Technologies Europe | Subject: VTEP
Edited by the Electronicstalk Editorial
Team on 18 February 2008
Novel approach to in-circuit testing
Technology is a hybrid between two established test methodologies in today's electronic manufacturing test environment: boundary scan and VTEP vectorless testing.
Agilent Technologies is set to offer in-circuit test (ICT) users an innovative way to test their printed circuit board assemblies (PCBAs) in a limited access environment without sacrificing test coverage or time to market - while simultaneously saving on fixture cost and reducing test resources The technology is a hybrid between two established test methodologies in today's electronic manufacturing test environment: boundary scan and VTEP vectorless testing
This article was originally published on Electronicstalk on 23 Feb 2007 at 8.00am (UK)
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The result is an extremely powerful tool that combines the standardised, limited access, digital stimulus capability of boundary scan with the industry-leading vectorless simplicity of VTEP.
Agilent has a proven track record of technological leadership in both of these arenas, spanning more than two decades.
This technology has profound implications on cost and quality.
Manufacturers of PCBAs now have the option to design circuit boards with less electrical test access, thus saving on fixture cost and reducing test resources.
Also, fewer probes in the test fixtures mean reduced strain on the PCBAs.
"Industry trends are pointing to shorter design cycles with each new generation of products incorporating more features and more advanced technology", says Adrian Cheong, ICT marketing manager with Agilent's Measurement Systems Division.
"We are standing at the threshold where conventional in-circuit test methods can no longer keep up with these technology advances".
"Agilent is committed to delivering real solutions that can meet the cost pressures of today's manufacturing environment".
"This technology builds on previous Agilent innovations in ICT such as VTEP v2.0, bead probe technology and our 1149.6 capability".
"Our customers depend on Agilent innovation to meet the test challenges of today's PCBAs".
Agilent customers with valid software upgrade contracts for the i3070 and VTEP-equipped fixtures will get to enjoy this new technology by purchasing an additional software licence and a fully VTEP-compatible fixture hardware upgrade.
Pricing for the license will include attractive bundles for new and current Agilent boundary-scan customers.
Pricing for the VTEP fixture hardware upgrade will be similar to existing Agilent VTEP fixture hardware products.
Limited shipments of the product will begin on 7th March 2008.
Full availability will be in the second half of 2008.
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