Product category:
ATE Systems
News Release from: Agilent Technologies Europe | Subject: Cover-Extend Technology
Edited by the Electronicstalk Editorial
Team on 21 March 2008
Test technology takes boundary scan a
step further
Novel limited access technique for in-circuit testing eliminates the need for physical test points, offering benefits that traditional vectorless testing cannot provide.
Agilent Technologies has unveiled a limited access solution for in-circuit test (ICT) users that eliminates the need for physical test points, offering benefits that traditional VTEP test cannot provide Part of Agilent's VTEP v2.0 Powered test suite, the Agilent Cover-Extend Technology is a hybrid between two established test methodologies in the electronic manufacturing industry: boundary scan and VTEP vectorless test
This article was originally published on Electronicstalk on 17 Jun 2008 at 8.00am (UK)
Related stories
More modules for multifunction measurement unit
Two new modules join the 19 modules already offered to make up a high-performance family of eight-slot mainframe switches with built-in DMMs.
Analyser options appeal to comms designers
New capabilities extend the analysis power of Agilent's signal and spectrum analysers, enabling them to address even the most difficult application challenges.
Unlike traditional VTEP test, which requires physical test points on the printed circuit board assembly (PCBA) for the injection of test stimulus signals, Agilent's Cover-Extend relies on stimulus provided by boundary scan cells, which do not require physical test points.
The benefits of this technology include improved test coverage, which preserves users' investment in in-circuit testers.
Cover-Extend can recover up to 50% node access.
It allows for significant savings on fixturing, a continuous operating cost that can easily exceed the price of the ICT system itself over time.
A typical factory using Cover-Extend on 30 lines can potentially save up to US $500,000 per year.
And the technology provides strain relief on solder joints because fewer test probes are needed underneath high-density ICs (such as BGAs), greatly reducing potential solder-joint damage due to excessive strain.
"Cover-Extend addresses key concerns in today's manufacturing environment - cost, coverage, quality and speed", says Daniel Mak, Vice President and General Manager of Agilent's Measurement Systems Division.
"The results we are getting from our customers' lines are very positive, and we will implement Cover-Extend in full-scale production environments with some of our key customers in April".
Agilent customers with valid software-upgrade contracts for the i3070 and VTEP-equipped fixtures can receive this new technology by purchasing an additional software license and a fully VTEP-compatible fixture hardware upgrade.
Pricing for the licence will include attractive bundles for new and current Agilent boundary-scan customers.
Pricing for the VTEP fixture hardware upgrade will be similar to existing Agilent VTEP fixture hardware products.
Limited shipments of the product have begun.
• Agilent Technologies Europe: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
