Stacking technology saves space and power

An Advanced Interconnect Technologies product story

Edited by the Electronicstalk editorial team Jan 31, 2007

AMI Semiconductor is in full production mode with AIT's stacked die quad flat package no leads module for various consumer electronics applications.

AMI Semiconductor (AMIS) is in full production mode with AIT's stacked die quad flat package no leads (QFN) module for various consumer electronics applications.

AIT's stacked die QFN package gives AMIS an ideal solution for deployment, as it provides overall power savings due to better electrical connectivity, a small footprint for increased board savings, and a lower overall total cost of ownership.

"We chose AIT's stacked die QFN package, as it was ideal for the way that we will be deploying these modules in high-volume consumer electronics applications", said Aran Idan, General Manager, Netlist Conversion SDP at AMI Semiconductor.

"Today's consumer applications need a small footprint, better thermal management and an increase in power savings, which we have found in AIT's stacked die QFN package".

AIT's stacked die QFN-MCM (multichip module) package features system in package (SiP) technology that is designed to place two or more die in a single package, resulting in smaller packages and thus reducing costs.

The SiP framework is designed to provide higher levels of integration, which decreases the number of needed components and trims the sise and routing complexity of the printed circuit board.

This stacking technology in a low-cost QFN package makes it an ideal solution for space-conscious designers of various consumer devices, such as AMIS.

"The stacked die QFN package is part of AIT's commitment in providing the market with world-class technology solutions that exceed customer expectations, while preserving a low total cost of ownership", said Bruno Guilmart, Chief Executive Officer at AIT.

"The stacked die QFN package was specifically designed to address the needs of next-generation designers such as AMIS, who need the latest and greatest packaging technology to realise volume deployment for new and compelling consumer applications".