Product category:
Test Accessories
News Release from: Aries Electronics | Subject: RF test sockets with thermoelectric cooling
Edited by the Electronicstalk Editorial
Team on 09 January 2003
RF test sockets gain thermoelectric
cooling
Aries Electronics now offers its lines of interposer, spring probe and Microstrip Contact RF test sockets with thermoelectric cooling.
Aries Electronics now offers its lines of interposer, spring probe, and Microstrip Contact RF test sockets with thermoelectric cooling Test sockets with the new conduction-cooling system are suitable for BGA, LGA and CSP package designs and are typically used in high-powered devices that require exceptional thermal management, such as in military applications
This article was originally published on Electronicstalk on 8 Apr 2002 at 8.00am (UK)
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Tool straightens pins with no static risk
Aries Electronics has introduced the first antistatic version of a tool that provides a fast, easy and inexpensive means of straightening the pins of DIP IC devices.
The use of thermoelectric cooling saves the user both time and money.
The system eliminates the need for other costly methods of thermal control, such as a flow stream system, since the test socket is in direct contact with the cooling system.
Additional thermal management properties that help reduce costs and testing time include a built-in thermistor to record temperatures and a copper heat sink with an integrated fan assembly.
Overall socket size is 63.5 x 63.5 x 88.9mm and can be used in packages up to 27 x 27mm.
Temperature range of the test sockets with thermoelectric cooling is -15 to +90C, with a maximum differential temperature of 70C.
Pricing for a 484-lead BGA spring probe socket starts at $5300 per unit, with quantity discounts available.
Delivery is 6 weeks ARO.
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