Side-stackable BGA socket is wizard idea

Edited by the Electronicstalk editorial team Apr 18, 2003

Aries Electronics has released the industry's first side-stackable BGA socket.

Aries Electronics has released the industry's first side-stackable BGA socket.

Designated the Pin-Ball socket, this device can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density.

The surface-mount BGA and LGA socket provides 2mm of clearance for end components and can be used for 1.00 and 1.27mm-pitch packages up to 50mm in any footprint and on any size board.

The Pin-Ball socket incorporates Aries' reliable spring probe technology, with a spring force of 17g at 0.025in deflection.

The new socket employs an Ultem insulator with stainless-steel hardware.

The spring is BeCu alloy and the pins are gold-plated brass alloy.

Users have the choice of a metal cover or customised aluminium heatsink.

The socket is available in two-bolt (15mm package or smaller) or four-bolt (16-50mm package) hold-down styles, depending on the device size required.

Pricing for the Pin-Ball socket starts at $1.00 per ball in quantities of five sockets.

Delivery is two weeks ARO.