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Product category: Test Accessories
News Release from: Aries Electronics | Subject: BGA/CSP test and burn-in sockets
Edited by the Electronicstalk Editorial Team on 10 July 2003

Test sockets handle device burn-in

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Aries Electronics now offers a BGA/CSP test and burn-in socket for devices with a pitch from 0.50mm or larger in applications up to 1GHz.

Aries Electronics now offers a BGA/CSP test and burn-in socket for devices with a pitch from 0.50mm or larger in applications up to 1GHz The new socket features a standard moulded socket format that can accommodate any device package up to 13mm2

It is ideal for test and burn-in of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash devices.

The socket incorporates solderless pressure-mount compression spring probes accurately located by two moulded plastic alignment pins and secured with four stainless steel screws, making for easy mounting to and removal from the burn-in board (BIB).

The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness.

The socket's small overall size allows the maximum number of sockets per BIB, and BIBs per oven, while allowing easy access for fast device insertion and removal.

The socket can accommodate up to 500,000 cycles.

Spring probe contacts are 9 to 12g per contact for 0.50 to 0.75mm pitches, and 17 to 20g per contact for 0.80mm pitches and larger.

Operating temperature of the socket ranges from -55 to +150øC.

The socket's moulded components are UL94V0 Ultem and machined components are UL94V0 Peek.

Spring probes are heat-treated beryllium copper alloy, plated with at least 0.75um gold per Mil-G-45204 over 0.75um nickel per QQ-N-290.

All hardware is stainless steel.

As with all Aries sockets, the new burn-in and test socket is available in custom materials, plating, sizes and configurations to suit specific customer applications.

Pricing for a 100-lead socket starts at $175 in single-piece quantities.

Delivery is 2 weeks ARO.

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