Product category:
Test Accessories
News Release from: Aries Electronics | Subject: CSP/uBGA test and burn-in socket
Edited by the Electronicstalk Editorial
Team on 29 September 2003
Socket puts CSPs and uBGAs to the test
A new CSP/uBGA test and burn-in socket can handle devices from 14 to 27mm2, in applications under 1GHz.
A new CSP/uBGA test and burn-in socket can handle devices from 14 to 27mm2, in applications under 1GHz The new pressure-mounted socket requires no soldering and is ideal for test and burn-in of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash devices with a pitch of 0.50mm and larger
This article was originally published on Electronicstalk on 8 Apr 2002 at 8.00am (UK)
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Aries Electronics has developed a high-frequency test socket with a replaceable spring probe interposer.
Aries' new test and burn-in socket incorporates spring probe contacts that offer maximum ease of use and flexibility.
The spring probe contact Interposer set can be easily replaced on-site, and interposer sets with different footprints for devices with the same overall package size can be used with the new socket.
The socket also features integral plastic alignment posts that accurately line up the spring probe interposer set and socket to the PCB for secure mounting, and a four-point crown to ensure "scrub" on the solder oxides.
The small overall size of the socket allows for the maximum number of sockets per burn-in board (BIB), and BIBs per oven, while providing easy access for fast device insertion and removal.
The signal path during test is only 1.92mm and operating temperature is -55 to +150C.
Based on a device with a 0.50mm pitch, maximum pin inductance of the new socket is 0.75nH, mutual inductance is less than 0.15nH and maximum mutual capacitance is 0.03pF.
Compression spring probes are heat-treated beryllium copper alloy with at least 0.75um gold per MIL-G-45204, over 0.75um nickel per QQ-N-290.
Contact force is 9 to 12g per contact for devices with pitches from 0.50 to 0.75mm, and 17 to 20g per contact for devices with an 0.80mm pitch or larger.
Estimated contact life is 500,000 cycles.
Moulded socket components are UL94V0 carbon-filled Peek or glass-filled Ultem, with a Teflon coated backing plate.
All hardware is stainless steel.
As with all Aries sockets, the new CSP/uBGA socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing starts at $130 each for a 100-ball package in burn-in quantities.
Delivery is 2 weeks ARO.
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