Product category:
Plugs and Sockets
News Release from: Aries Electronics | Subject: 8th Edition Shortform Catalog
Edited by the Electronicstalk Editorial
Team on 12 November 2004
Catalogue covers pin ball BGA sockets
Aries Electronics has published its new 8th Edition shortform catalogue covering a broad range of interconnection and packaging products.
Aries Electronics has just published its new, 8th Edition shortform catalogue covering a broad range of interconnection and packaging products The new, 12-page catalogue includes the first side-stackable BGA socket available on the market
This article was originally published on Electronicstalk on 8 Apr 2002 at 8.00am (UK)
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Tool straightens pins with no static risk
Aries Electronics has introduced the first antistatic version of a tool that provides a fast, easy and inexpensive means of straightening the pins of DIP IC devices.
Designated the Pin-Ball Socket, this device can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density.
The Pin-Ball Socket incorporates Aries' reliable spring probe technology.
Also detailed are Aries' Correct-A-Chip technology and products, which enable designers to convert virtually any package type or footprint to any other.
Typical Correct-A-Chip products include DIP-to-PLCC adapters, standard DIP adapters, DIP-to-SOIC adapters, SMD-to-DIP adapters, PGA adapters, and countless other "from-to" configurations while enabling designers to upgrade without board redesign or rework.
Also included in the catalogue are data and product information on Aries' high-frequency RF test sockets, which use the company's patented Microstrip Contact system.
Aries' line of BGA products for chip scale packaging is also covered in the catalogue, as are Aries' LGA sockets, test and burn-in sockets, display sockets, cable jumper assemblies, DIP/SIP sockets and headers, programming devices and other socket packages.
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