Product category:
Test Accessories
News Release from: Aries Electronics | Subject: Centre probe debug socket
Edited by the Electronicstalk Editorial
Team on 13 December 2004
Centre probe socket speeds debug
operations
A novel solderable centre probe socket enables users to debug a wide range of package types - BGA, UBGA, MLF, QFN and others - on the same package footprint.
Aries Electronics has developed a novel solderable centre probe socket which enables users to debug a wide range of package types - BGA, UBGA, MLF, QFN and others - on the same package footprint This new surface mount adapter securely connects to standard Aries centre probe test sockets, providing a quick and highly reliable package test on populated PC boards
This article was originally published on Electronicstalk on 8 Apr 2002 at 8.00am (UK)
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The new debugging socket provides 1.52mm clearance for 0.80mm and higher package pitch.
The socket pressure mounts to the adapter, which is soldered to the pre-existing PCB footprint via standard reflow process.
The new Aries debug socket features an insertion loss of only 1dB up to 5GHz.
Socket cycle life is over 100,000 insertions and withdrawals.
Useable for virtually all packages up to 13mm square, the new socket is particularly ideal for SRAM and DRAM packages.
Pricing for a new solderable centre probe debug socket starts at $194 each at 100 pieces.
Delivery is six weeks ARO.
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