Product category:
Plugs and Sockets
News Release from: Aries Electronics | Subject: Pin-Ball socket
Edited by the Electronicstalk Editorial
Team on 09 March 2005
Socket suits high-end graphics
processors
Aries Electronics has introduced a high pin count (over 1400 ball) version of its unique Pin-Ball socket, featuring a customised heatsink, designed for high-end graphics processors.
Aries Electronics has introduced a high pin count (over 1400 ball) version of its unique Pin-Ball socket, featuring a customised heatsink, designed for high-end graphics processors The new Pin-Ball socket can be soldered directly to the existing footprint of a PC board, further increasing packaging density
This article was originally published on Electronicstalk on 18 Apr 2003 at 8.00am (UK)
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Side-stackable BGA socket is wizard idea
Aries Electronics has released the industry's first side-stackable BGA socket.
An aluminium heatsink provides effective thermal dissipation of excess heat generated by the high performance graphics processors for which the socket is designed.
The versatile BGA/LGA socket provides 2mm of clearance for end components and can be used for 0.80, 1.00 and 1.27mm pitch packages up to 50mm, in any footprint configuration and on any size board.
The new socket incorporates Aries high reliability spring probe technology, with a spring force of 17g at 0.025in deflection.
The spring is BeCu alloy, and the pins are gold-plated brass alloy.
The socket insulator is Torlon or Peek with stainless steel hardware.
The socket can be furnished with either a two-bolt (for 15mm packages and smaller) or four-bolt (for 16-50mm packages) hold-down.
Pricing for a 1400-contact Pin-Ball socket is $1500 each (including heatsink) in single-piece quantities.
Delivery is 4 weeks ARO.
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