Product category:
Test Accessories
News Release from: Aries Electronics | Subject: Dynamic burn-in sockets
Edited by the Electronicstalk Editorial
Team on 05 December 2005
Burn-in socket supports devices up to
13mm2
A new dynamic burn-in socket is ideal for all CSP, MLF, QFN, BGA, uBGA and LGA packages with a pitch of 0.50mm and larger, for applications up to 18.5GHz.
Aries Electronics has released a new dynamic burn-in socket for devices up to 13mm2 The new burn-in socket is ideal for all CSP, MLF, QFN, BGA, uBGA and LGA packages with a pitch of 0.50mm and larger, for applications up to 18.5GHz
This article was originally published on Electronicstalk on 8 Apr 2002 at 8.00am (UK)
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Tool straightens pins with no static risk
Aries Electronics has introduced the first antistatic version of a tool that provides a fast, easy and inexpensive means of straightening the pins of DIP IC devices.
The pressure-mounted socket requires no soldering and incorporates Aries' proprietary spring probe technology for higher performance and lower cost.
The spring probe includes either a four-point crown tip for ball terminations or a 0.004in flat tip probe for pad terminations.
The burn-in socket features a bandwidth of 1dB at 18.5GHz.
Contact force is 12 to 15g per contact for devices with pitches up to 0.80mm.
Estimated contact life is 10,000 cycles.
Contact resistance is less then 40mohms and contact inductance is 0.59nH at 0.50mm pitch.
Operating temperature is -25 to +125C.
Compression spring probes are heat-treated beryllium copper alloy with 0.75um gold per MIL-G-45204, over 0.75um nickel per QQ-N-290.
moulded socket components are UL94V0 glass-filled Ultem and all hardware is stainless steel.
As with all Aries sockets, the new dynamic burn-in socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a dynamic burn-in socket with up to 50 pins is $239 per socket in quantities of 25 or more.
Delivery is five weeks ARO.
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