Product category:
Test Accessories
News Release from: Aries Electronics | Subject: Dynamic burn-in socket
Edited by the Electronicstalk Editorial
Team on 16 March 2006
Burn-in socket springs into action
A new dynamic burn-in socket handles devices from 14 to 27mm2.
Aries Electronics has released a new dynamic burn-in socket for devices from 14 to 27mm2 The RoHS-compliant socket is ideal for all CSP, MLF, QFN, BGA, uBGA and LGA packages with a pitch of 0.50mm and larger for applications up to 18.5GHz
This article was originally published on Electronicstalk on 5 Dec 2005 at 8.00am (UK)
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Burn-in socket supports devices up to 13mm2
A new dynamic burn-in socket is ideal for all CSP, MLF, QFN, BGA, uBGA and LGA packages with a pitch of 0.50mm and larger, for applications up to 18.5GHz.
The pressure-mounted socket requires no soldering and incorporates Aries' proprietary spring probe technology for higher performance and lower cost.
The spring probe includes either a four-point crown tip for ball terminations or a 76um flat tip probe for pad terminations.
The burn-in socket features a bandwidth of 1dB at 18.5GHz.
Contact force is 24 to 30g per contact for devices with pitches up to 0.75mm and 22 to 28 g for devices with pitches of 0.80mm or larger.
Estimated contact life is 500,000 cycles.
Maximum contact resistance is 40mohm and contact inductance is 0.51nH.
Operating temperature is -25 to +150C.
Compression spring probes are heat-treated beryllium copper alloy with at least 0.75um gold per MIL-G-45204, over 0.75um nickel per QQ-N-290.
Moulded socket components are UL94V0 glass-filled Ultem and all hardware is stainless steel.
As with all Aries sockets, the new dynamic burn-in socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a dynamic burn-in socket with up to 200 pins is $479 per socket in quantities of ten or more.
Delivery is five weeks ARO.
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