Product category:
Test Accessories
News Release from: Aries Electronics | Subject: CSP test socket
Edited by the Electronicstalk Editorial
Team on 11 October 2006
Test socket accesses fine-pitch devices
CSP test socket for devices from 28 to 40mm2 is ideal for manual testing of devices with pitches down to 0.40mm.
Aries Electronics has introduced a new CSP test socket for devices from 28 to 40mm2 The new socket is ideal for manual testing of devices with pitches down to 0.40mm, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices
This article was originally published on Electronicstalk on 8 Apr 2002 at 8.00am (UK)
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The new socket provides minimal signal loss for higher bandwidth capability via a signal path of only 1.95mm.
The socket's overall size of 77.47 x 63.50 x 32.28mm provides the maximum allowable space for board components and connectors.
Solderless, pressure-mount compression spring probes allow the socket to be easily mounted to and removed from the test board.
These gold-over-nickel compression spring probe screws leave very small witness marks on the bottom of the device solder balls, and are accurately located by two moulded plastic alignment pins and secured with four stainless steel screws.
The four-point spring probe crown on the new socket ensures "scrub" on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other device types.
The compression spring probes are heat-treated beryllium copper alloy, plated with at least 0.75um gold per MIL-G-45204 over 0.75um nickel per QQ-N-290.
The socket's moulded components are UL94V0 Peek and/or Ultem.
All hardware is stainless steel.
Contact forces of the new sockets are 16g per contact for 0.40mm pitch and 25g per contact for 0.50mm pitches and larger.
Operating temperature is -55 to +150C.
Estimated contact life is over 500,000 cycles.
Pricing for a 100-pin socket starts at $170.00.
Delivery is four to six weeks ARO.
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