Aries unveils centre probe test socket

Edited by the Electronicstalk editorial team Oct 9, 2008

Aries Electronics now offers a high-frequency centre probe test socket comprised of a standard moulded format that enables the socket to accommodate any device 6.5mm or smaller.

With the new device compatibility, this centre probe test socket is suitable for use with test and dynamic burn in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.

The test socket offers machined pressure pads and interposers for use in small quantities and custom moulded pressure pads and interposers for large quantities.

The socket's pressure pad compression spring also allows for height variation in device thickness and provides proper force against the device.

The socket features solderless pressure mount compression spring probes, which are accurately located by two moulded plastic alignment pins.

The socket can be mounted to and removed from the printed circuit board (PCB) using two stainless steel mounting screws.

The spring probes are made of heat-treated beryllium-copper alloy.

The probes feature contact forces of 15g per contact on 0.30mm to 0.35mm pitches, 16g per contact on 0.40mm to 0.45mm pitches, 25g per contact on 0.50mm pitches or larger.

The test socket benefits from <40 milliohms of contact resistance, an operating temperature of -55C to 150C (-67F to 302F) and a contact life of an estimated 500,000 cycles minimum.

As with all sockets from Aries, this centre probe test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.