Aries releases compact test and burn-in sockets

Edited by the Electronicstalk editorial team Nov 11, 2008

Aries Electronics is offering its high frequency Center Probe and CSP/MicroBGA test and burn-in sockets in sizes up to 6.5mm squared with pitches down to 0.3mm.

The reduced socket pitch meets the growing need to test smaller components.

The sockets have operating temperature from -55 to +150C and are ideal for devices that require good thermal management qualities in a compact package.

The sockets feature replaceable interposer sets and require minimal handler tooling for use in an increased number of CSP, MicroBGA, DSP, LGA, Sram, Dram and Flash devices.

The sockets have operating temperature from -55 to +150C and are ideal for devices that require good thermal management qualities in a compact package.

The sockets' solderless pressure-mount compression spring probes, accurately located by two moulded plastic alignment pins and mounted with two stainless steel screws, enable easy mounting to and removal from the printed circuit board (PCB) for RF sockets and the burn-in-board (BIB) for test and burn-in sockets.

The heat-treated beryllium copper compression spring probes are plated in a minimum of 30 micron in (0.75 micron mm) gold per MIL-G-45204 over a minimum of 30 micron in (0.75 micron mm) nickel per SAE-AMS-QQ-N-290, so spring probes leave small witness marks on the solder balls' bottom surface.

The probe can be either sharp point (for non-BGA devices) or crown-shaped (for BGA).

The four-point crown version ensures scrub on the solder balls and a pressure-pad compression spring provides the proper force against the device to allow height variations in device thickness.

Signal path of the sockets is 0.077in (1.96mm).

Sockets with a 0.30 to 0.35mm pitch feature 15g of contact force per contact and a test PCB diameter (P) of 0.009in (0.23mm).

Each socket is rated for a minimum of 500,000 cycles.

Moulded components come standard in UL94V-0 Ultem but the new sockets are available in custom materials, platings, sizes and configurations to suit specific customer applications.