Aries test sockets have adjustable pressure pad

Aries Electronics is offering its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad.

With a 0.010in (0.254mm) displacement per revolution of the screw, this mechanism makes the sockets ideal for testing very small, fragile devices, such as thin or ceramic chips, without causing damage, and devices with large height tolerances.

Users can back off the adjusting screw and close the socket's lid securely with one finger and very little force, and then modify the pressure pad force with the adjusting screw after the lid is closed to ensure good contact.

The screw can also be adjusted based on device height from chip to chip eliminating socket rework downtime to design a new pressure pad.

Each adjustable pressure pad comes with a user-adjustable washer stack in 0.001in (0.0265mm) and 0.010in (0.254mm) increments that serves as a hard stop to eliminate device over-compression.

If constant large device height changes are expected during testing, the washer stack can be removed without affecting the socket's performance.

The Aries CSP/MicroBGA test and burn-in socket range accommodates a variety of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices from 6.5mm-55mm squared by using machined or custom-moulded pressure pads and interposers.

With a signal path of only 0.077in (1.96mm), the sockets provide minimal signal loss for higher bandwidth capability.

The sockets allow the maximum number of sockets per BIB (burn-in board) and BIBs per oven, while remaining operator friendly.

They use solderless pressure mount compression spring probes accurately located by two moulded plastic alignment pins and mounted with stainless steel screws, making it easy to mount and remove them from the test board.

The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability.

Probes are constructed of heat-treated beryllium-copper with a minimum of 30 micro inches (0.75 micro mm) gold per MIL-G-45204 over a minimum of 30 micro inches (0.75 micro mm) nickel per SAE-AMS-QQ-N-290 plating.

Contact forces are 15G per contact on a 0.30mm to 0.35mm pitch; 16G per contact on a 0.40mm to 0.45mm pitch; and 25G per contact on pitches of 0.50mm or larger.

Operating temperature is -55C to +150C (-67F to +302F) and estimated contact life is a minimum of 500,000 cycles.

Moulded socket components are Ultem; machined socket components (if required) are PEEK or Torlon; and hardware is stainless steel.

As with all Aries sockets, the CSP/MicroBGA test and burn-in sockets are available in custom materials, platings, sizes and configurations to suit specific customer applications.

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