Improved planarisation for substrates

Edited by the Electronicstalk editorial team Apr 25, 2002

DuPont Air Products NanoMaterials has unveiled an ammonia-stabilised colloidal silica slurry for enhanced chemical mechanical planarisation (CMP) processes.

DuPont Air Products NanoMaterials, a 50/50 joint venture between DuPont and Air Products and Chemicals, has unveiled an ammonia-stabilised colloidal silica slurry for enhanced chemical mechanical planarisation (CMP) processes.

CMP involves the mechanical grinding and chemical etching of various dielectric and metal layers in the manufacture of an integrated circuit.

Slurries are comprised of very fine silica particles dispersed in water along with chemicals.

They are used to polish surfaces of electronic substrates and devices to smooth finishes.

DA NanoMaterials' newest slurry offering will be marketed under the Ascend OX-200 trademark, joining other slurries the joint venture markets under its Syton and Mazin trademarks.

Ascend OX-200 slurry has an average particle size of 40nm.

It contains low levels of metals and sodium and is recommended for CMP applications which may be sensitive to these impurities.

In comparative analyses of Ascend OX-200 and a competitive colloidal slurry on both one-platen and multi-platen tools, Ascend OX-200 was proven to provide better removal rates and lower defective rates.

DA NanoMaterials will manufacture the slurry blend at its world-class facility in Ruabon, Wales to supply the global slurry market - an estimated $500 million annual market that is growing at a rate of 20-25% per year.

"Ascend OX-200 slurry has proven performance utilising various tool parameters that allow the process to be dialled into specific performance requirements", noted Michael C Springman, vice president, Sales and Marketing for DA NanoMaterials.

"It is another important addition to our growing product line as we look to provide better slurry and services and respond to our customers' needs even faster".

Springman noted that the slurry has already been tested and proven both in the company's laboratories and at numerous customer sites.

The development and commercialisation of Ascend OX-200 initially sprang from market demand for a versatile slurry that could be used in both STI and interlayer dielectric polishing applications.