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Alphasem
Address:
Andhauserstrasse 52
Berg/TG
CH-8572
Switzerland
Telephone: (Switzerland) +41 71-637 62 10
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Listing of all 10 news releases from Alphasem:
Medical sensor maker receives die bonder
Merit Sensor has received its first Alphasem Easyline 8088 "sensor bonder".
News from Alphasem (13 June 2006)
Promotion for Ossmann
Alphasem has appointed Christian Ossmann as European Sales Manager to strengthen its position within the first level packaging market.
News from Alphasem (12 June 2006)
Die bonders gain integrated tape applicator
A new integrated tape applicator meets the stringent process requirements of leading-edge stacked-die package assembly in the high-volume manufacturing environment.
News from Alphasem ( 4 May 2006)
Die bonder to enable microphone expansion
User application article Alphasem's semiconductor technology has been evaluated by Knowles for its leading edge manufacturing process of semiconductor microphones.
News from Alphasem (14 April 2006)
Penang is new base for Asian applications
Alphasem will officially open its new application and training center in the industrial district of Penang on 20th January 2006 to further strengthen process and application support in Southeast Asia.
News from Alphasem (11 January 2006)
Chinese subsidiary expands into new premises
Three years after founding a subsidiary in Shenzhen in 2002, Alphasem has relocated to larger premises in Suzhou.
News from Alphasem (11 October 2005)
Milestone for die attach systems
Alphasem has set a production milestone by shipping its 250th second generation Swissline machine to North America.
News from Alphasem (11 October 2005)
Die bonder turns to sensor assembly
A new machine is the first to offer die bond technology proven in high volume production at an attractive price/performance ratio for the sensor and micro assembly market.
News from Alphasem (11 October 2005)
Die attach systems prove popular
Alphasem has received an order for a further 18 Swissline die attach systems from Siliconware Precision Industries Co.
News from Alphasem ( 7 October 2005)
Die bonder suits Swiss sensor startup
Alphasem has delivered one of its new Easyline 8088 die bonders to Swiss startup Sensirion.
News from Alphasem ( 7 October 2005)

