Product category:
PCB Assembly Equipment and Tools
News Release from: Alliance Sales (Europe) | Subject: Accretech A-WD-300T and A-WD-200T
Edited by the Electronicstalk Editorial
Team on 11 April 2002
High-throughput dicing systems roll into
Europe
Alliance Sales (Europe) has been appointed the Northern Europe agent for Accretech, formerly Tokyo Seimitsu (TSK).
Alliance Sales (Europe) has been appointed the Northern Europe agent for Accretech, formerly Tokyo Seimitsu (TSK) The Japanese company is a world-leading specialist in wafer dicing, thinning and polishing and wafer probing systems
This article was originally published on Electronicstalk on 23 Sep 2002 at 8.00am (UK)
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One of the new Accretech products to be unveiled in Europe by Alliance Sales (Europe) is the fully automatic A-WD-300T dicing system.
An easy to operate twin-spindle dicing system the A-WD-300T handles 300mm wafers and combines high throughout with precise positioning.
The A-WD-300T dicing system's novel face-to-face front mounted spindle arrangement minimises motion and offers a positioning accuracy of 2um even at high throughputs.
Maximum spindle speeds are up to 60,000rev/min.
The system's usable frame size can be either 8 or 12in.
The A-WD-300T's compact design results in a space saving footprint of 1550mm wide by 1500mm deep.
The dicing system is simple to operate using a GUI on a high-resolution LCD touch panel screen.
An I300I compliant loadport can be offered in order to match advanced factory automation concepts for 300mm production.
Accretech has also developed the highly reliable, high-throughput A-WD-200T dicing machine.
The A-WD-200T's usable frame size can be 5, 6 or 8in.
The system's use of a linear motor for the x-axis reduces vibration and the construction of the support mechanism gives the spindle greater rigidity and enhances the quality of the cutting performance.
The use of air bearings and ceramic guides in addition to featuring a linear motor on the x-axis produces a completely contact-free drive mechanism that is maintenance free.
Both A-WD-300T and A-WD-200T dicing systems can also be equipped with a series of optional features such as a blade breakage detection monitoring system, an optical cutter set unit, a shape recognition device, a cassette for automatic dressing, barcode recognition for automatic device changeover, SECS/GEM software and a low-cost, high performance UV curing unit.
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