Product category:
PCB Assembly Equipment and Tools
News Release from: Alliance Sales (Europe) | Subject: Neptco Wafertape
Edited by the Electronicstalk Editorial
Team on 06 June 2003
Tape reduces wafer waste
A new range of wafer dicing tapes designed to assure consistent, precise and repeatable wafer production yields has been introduced to Europe by Alliance Sales (Europe).
A new range of wafer dicing tapes designed to assure consistent, precise and repeatable wafer production yields has been introduced to Europe by Alliance Sales (Europe) Neptco's Wafertape range of dicing tapes reduce silicon residues by applying superior coating technology that features total thickness variation (TTV) control, an expandable base film plus a special low-extractable release liner
This article was originally published on Electronicstalk on 11 Apr 2002 at 8.00am (UK)
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Alliance Sales (Europe) has been appointed the Northern Europe agent for Accretech, formerly Tokyo Seimitsu (TSK).
Ideal for mounting wafers on a frame in preparation for dicing, the Wafertape dicing tape range is specially constructed using a PVC base film, pressure sensitive adhesive and a release film.
The benefits of using the Wafertape range include the consistent release of sawn die and an expandable base film.
The tapes are transparent which helps both human and electronic vision die defect recognition.
Wafertape's dicing tape range is available in standard widths of 200, 230, 250, 275, 300, 330 and 400mm.
Custom widths can also be supplied.
Alliance Sales (Europe) is responsible for sales and technical support in the UK, Scandinavia and Finland of Neptco's wide range of wafer dicing tapes for semiconductor industry applications.
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