Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Almit Technology | Subject: LFM range
Edited by the Electronicstalk Editorial
Team on 12 August 2002
Solder simplifies switch to lead-free
process
Almit Technology will be showing a new range of lead-free solder products that use the latest developments in flux technology at this year's Nepcon exhibition.
Almit Technology will be showing a new range of lead-free solder products that use the latest developments in flux technology at this year's Nepcon exhibition The LFM (lead-free materials) range has been developed by chemists at Almit's Japanese parent company, the Nihon Almit Corporation, to optimise flux formations and guarantee superior soldering performance
This article was originally published on Electronicstalk on 23 May 2008 at 8.00am (UK)
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Dipping paste handles significant warping
Almit's LFM 48N dipping paste is ideal for holding larger area devices that often exhibit warping during reflow.
Lead-free solder wire is kind to tips
No-clean cored solder wire is developed for manufacturers who do not require silver in lead-free materials.
The new LFM TM48 lead-free solder paste and the LFM SH and SR lead-free cored wires all offer zero lead content, employing instead percentages of silver, copper and tin to impart advantageous operating characteristics.
Excellent wetting properties and complete consistency are ensured as a result of the unique and patented flux chemistry employed throughout the range, which removes the naturally occurring water from the flux rosin.
With a melting point of 220C, LFM TM48 is suitable for a wide range of applications including navigation systems, cluster assemblies, palm top and pocket PCs, stereos and televisions.
LFM SH and LFM SR cored wire are both ideal for no clean and low residue hand soldering, with applications in the automotive and consumer electronics industries.
While the lead content in traditional 60/40 tin-lead solder is responsible for much of its desirable characteristics, Almit's new tin-silver-copper products combat the problems associated with the removal of lead, providing solutions with acceptable melting points, good wettability and excellent joint strength and flexibility.
Peter Martin, Almit's European Sales Director, comments: "The problems facing solder manufacturers are complex, as the sophisticated electronics manufacturing techniques used today have been developed around lead-based technologies.
At Almit we recognise this, and are addressing the issue in such a way as to ensure that the changeover to lead-free manufacturing has as little impact on production as possible".
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