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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Almit Technology | Subject: Lead-free solder materials and chemicals
Edited by the Electronicstalk Editorial Team on 08 April 2005

Lead-free solder materials and chemicals
on show

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Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at SMT Nurnberg 2005.

Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at SMT Nurnberg 2005 The company's Pb-free solder paste formulations and solder wire have been proven in use for many years in Japan

Almit will be represented by Weeger on Stand 345 in Hall 9.

LFM-48 TM HP Pb-free solder paste from Almit is a latest generation tin-copper-silver alloy formulation exhibiting good wetting, easy low-residue printing with long screen and tack life.

It is already approved by, and in use with, major manufacturers around the world, and is suitable for both open blade printing and enclosed print head systems.

Almit will also show the world's best cored solder wire, which is now available in industry standard 96.5%Sn-3%Ag-0.5%Cu Pb-free alloy.

The KR-19SH RMA wire retains all the benefits and advantages of the original product to deliver excellent wetting, high reliability and low residue.

It is available is a range of diameters from 0.3 to 1.6mm on 0.5kg reels - and in selected sizes on Almit's new antistatic handy reels.

Almit has been supplying Pb-free solder materials for volume electronics manufacturing production in its home market for over several years, and to the automotive industry for almost a decade.

Addressing these localised lead-free process requirements has put Almit ahead of the curve in the global Pb-free changeover initiative now in progress to meet the European July 2006 deadline.

Experienced engineering and process staff from Almit will be on hand at SMT Nurnberg on Stand 9-345 (Hall 9) to advise and guide on all aspects of lead-free changeover issues.

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