Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Almit Technology | Subject: SJ7 solder alloy
Edited by the Electronicstalk Editorial
Team on 21 July 2006
SJ7 solder alloy from Almit Technology
SJ7's resultant ability to deliver a superior performance under highly challenging conditions is currently driving its widespread adoption in aerospace and military applications
Is characterised by its significant mechanical advantages over conventional tin-lead solders SJ7's resultant ability to deliver a superior performance under highly challenging conditions is currently driving its widespread adoption in aerospace and military applications
This article was originally published on Electronicstalk on 12 Aug 2002 at 8.00am (UK)
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"As a highly experienced solder and materials specialist, we know that the demands placed on those in the aerospace and military industries are unrivalled," explains Almit's Chris Ward.
"These manufacturers require complete product reliability and consistency - without compromise".
"This is why Almit developed SJ7, optimised to deliver an exceptional performance in high demand applications, involving harsh environments, thermal cycling and high strain".
"Currently in use in today's challenging Automotive, Military and Aerospace industries, SJ7 has been proven in battleground military vehicles and strike aircraft around the world".
Extensive testing has confirmed the paste's ability to offer manufacturers dramatically improved tensile and creep strength properties over traditional tin-lead solders at both room and elevated temperatures.
During testing in which pieces were held under a constant temperature of 100C, SJ7's recorded time to rupture exceeded 4,500 hours, compared to tin-lead's best time of 150 hours.
In addition, SJ7 also exhibited impressive wetting capabilities and exceptional yield for significantly higher throughput.
Meanwhile, a highly refined grain structure also means that during thermal cycling, Mean Time Before Failure is greatly increased for manufacturers using SJ7.
Available in both solder paste and wire form, Almit SJ7 displays excellent printing, slump and reflow properties.
The high strength solder paste is supplied with a Rosin Mildly Activated (RMA) Flux and, notably, does not require manufacturers to alter existing tin-lead profiles.
For optimum operational flexibility, the solder wire is available in diameters down to 0.5mm, enabling use with small components.
The SJ7 wire is also supplied with Almit's celebrated KR-19SH RMA flux.
Both SJ7 products can be effectively cleaned with designated solvent and semi-aqueous cleaning systems.
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