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Rework flux works with lead and lead-free solders

Edited by the Electronicstalk editorial team Nov 27, 2006

Novel flux technology is uniquely optimised to deliver a high performance with both lead-free and conventional tin-lead solders.

Almit Technologies has launched SR-7, a high-reliability general-purpose liquid rework flux.

No clean, low residue and halide free, Almit's new flux technology is uniquely optimised to deliver a high performance with both lead-free and conventional tin-lead solders.

Ideally suited to reworking or post mass soldering applications, Almit SR-7 is an easy-to-use rosin-free material designed to deliver excellent soldering on all commonly used printed circuit board finishes, from lead-free HASL to immersion silver, tin ENIG and OSP.

An inherent low solids content ensures that the minimal post soldering residues are nonsticky, thereby allowing for more efficient and unhindered probe testing.

Meanwhile, complete compliance with Bellcore SIR guarantees manufacturers a highly reliable, superior soldering performance.

"Given its wide compatibility, Almit SR-7 is ideal for use in today's diverse manufacturing environments", explains Almit's Chris Ward.

"While compliance with lead-free is now standard, our new flux is also a good option for manufacturers still required to work with conventional tin-lead solders".

"When combined with the flux's high reliability, this level of adaptability makes SR-7 an ideal choice for a wide range of demanding applications".

Almit SR-7 is fully compatible with all Almit solder pastes and cored wires.

Representing a further level of product flexibility, the liquid flux is available in five litre and one litre plastic containers, and also in pen format.