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Leading-edge solder technologies at Nepcon

Edited by the Electronicstalk editorial team Mar 15, 2007

Almit Technology will showcase a range of leading-edge solder technologies at this year's Nepcon exhibition, being held at the Birmingham NEC from 15th to 17th May.

Almit Technology will showcase a range of leading-edge solder technologies at this year's Nepcon exhibition, being held at the Birmingham NEC from 15th to 17th May.

Stand G50 will highlight the company's very latest product releases, including the Almit SR-7 liquid rework flux, designed to deliver excellent soldering in diverse manufacturing environments.

The Almit SR-7 is a high reliability general purpose liquid rework flux, presenting today's manufacturers with a no clean, low residue and halide free technology for both lead-free and conventional tin-lead solders.

Optimised to deliver a high soldering performance with a range of printed circuit board finishes - from lead-free HASL to immersion silver, tin ENIG and OSP - the highly reliable Almit SR-7 is ideally suited to rework or post mass soldering applications.

Nepcon visitors will also discover Almit's increasingly popular SJ7 solder alloy, along with its ability to offer significant mechanical advantages over conventional tin-lead solders.

Currently being widely adopted in automotive, aerospace and military applications, Almit SJ7 is optimised for high demand conditions involving thermal cycling and high strain.

Improved tensile and creep strength, time to rupture, wetting capabilities and yield are just some of the performance benefits associated with this breakthrough solder technology.

Stand G50 will feature an extensive range of proven Almit solder technologies, including the LFM-48 TM HP (S) fast-print solder paste currently being deployed around the world at excursion speeds of up to 100mm/s to drive up productivity through substantially reduced tact time.

Continuing the stand's focus on high speed printing, Almit's LFM-48 TM HP will also be on display at Nepcon, where the Almit team will showcase its ability to deliver high definition printing with long screen and tack life.

Other Almit stand highlights will include the KR-19SH RMA high quality cored solder wire for through hole assembly and rework.

With extensive experience in the supply of lead-free solder materials for volume electronics manufacturing production, Almit's Nepcon stand will highlight its commitment to driving productivity in worldwide assembly markets.

Reinforcing this commitment, experienced engineering and process staff from Almit will be on stand for the duration of the show to answer any visitor questions.