Tools accelerate DSP-based audio design

AMI Semiconductor has released its next generation evaluation and development kit (EDK 3.0) for its DSP-based standard products aimed at audio and audiology applications.

AMI Semiconductor has released its next generation evaluation and development kit (EDK 3.0) for its DSP-based standard products aimed at audio and audiology applications.

The company has also released a communication accelerator adapter (CAA) device for high-speed communication with devices built with AMI Semiconductor's DSP based products.

"The availability of the EDK and CAA strongly support our commitment to the development of tools for ultra-low-power DSP technology", said Robert Tong, Senior Vice President of AMI Semiconductor's Medical and Wireless Group.

"Development tools continue to grow in importance when choosing from the wide universe of available DSP-based platforms".

"As a company, AMIS will continue to enhance its offerings to simplify and shorten the design cycle and help OEMs achieve quicker time-to-market advantages".

EDK 3.0 provides an advanced integrated development environment enabling development teams to program advanced, customised software for their specific signal processing applications.

These include digital hearing aids, communication and listening devices, wireless and speciality headsets, remote sensors and other portable industrial/commercial applications.

The EDK supports the highly flexible architecture of the company's Toccata Plus, Orela 4500, BelaSigna 200 and the recently announced BelaSigna 250 DSP-based platforms.

Future platforms will be accommodated with downloadable modules.

This suite of software tools allows DSP engineers to perform edit, build and debug activities.

The suite also takes advantage of project management and team collaboration features in the same integrated environment.

CAA is an optimised communications interface for AMIS DSP-based products and is designed to be compatible with future AMIS DSP-based audio and audiology products.

CAA offers high speed USB-I2C translation for AMIS Orela 4500 and BelaSigna 250 products, as well as USB communication support that is faster than traditional level translators.

"Our users need a leading edge toolset to push their signal processing software development to the next level", said Todd Schneider, Senior Director of Medical and Wireless Products, AMI Semiconductor.

"Both the EDK and CAA simplify the transition from offline to real-time development and support team-based development".

"We believe they will help to drive market-leading applications for AMIS DSP technology".

EDK 3.0 and CAA are available now.

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