Audio DSP shrinks to one-seventh the size

A new miniature version of the BelaSigna 200 audio processing chip is optimised for use in advanced small-form-factor precision audio products for consumer and industrial markets.

AMI Semiconductor has developed a new miniature version of its BelaSigna 200 audio processing chip, optimising the technology for use in advanced small-form-factor precision audio products for the consumer and industrial markets.

The product has been developed based on a new miniature chip-scale package (CSP) measuring 3.8 x 2.4mm, approximately one-seventh the size of the previously available QFN package.

BelaSigna 200 interfaces seamlessly with wireless technology including Bluetooth subsystems and consumes only a few milliamps of current at 1.8V.

It contains a DSP core, stereo codec, memory, power management, and a highly efficient, hardware-based WOLA filter-bank coprocessor, which greatly reduces power consumption and chip sise while providing low group delay and adjustable parameters for easy integration into a wide range of designs.

"We have witnessed good success with BelaSigna 200 since its market introduction".

"It is the most complete, lowest power and smallest programmable audio processing system available, which also offers the flexibility of a generic DSP system at the size and power consumption of a dedicated ASIC", said David Coode, Manager of AMI Semiconductor's Audio Group.

"The new miniaturised version enables our customers to design BelaSigna 200 into even smaller products".

Currently, BelaSigna 200 is targeted for use in small-form-factor precision digital speech- and audio-centric products such as wireless headsets and headphones.

These popular devices continue to shrink in size to become more discreet and comfortable to wear.

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