Product category:
Analogue and Mixed Signal ICs
News Release from: AMI Semiconductor | Subject: Analogue arrays
Edited by the Electronicstalk Editorial
Team on 08 November 2006
Analogue arrays ease mixed-signal ASIC
design
AMI Semiconductor has expanded its capabilities by offering new analogue array methodology.
AMI Semiconductor (AMIS) has expanded its capabilities by offering new analogue array methodology The approach uses proven blocks of circuitry combined with custom interconnect layers to produce finished ASICs that incorporate both analogue and digital elements in short lead times and with low NREs
This article was originally published on Electronicstalk on 26 Mar 2001 at 8.00am (UK)
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Analogue arrays provide flexible and fast time to market solutions for use in the industrial, medical and consumer markets.
Example applications include security sensing, identification, light sensing, and battery management for industrial applications; and glucose meters, blood analysers and sensor interfaces for medical devices.
The wide range of proven design blocks that are combined to structure an array and to meet customers' specific applications include amplifiers, compactors, analogue-to-digital and digital-to-analogue convertors, EEPROM, temperature sensors, oscillators, voltage references, and more.
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A choice of more than 50 different arrays, offered in many sizes, configurations and technologies, allows AMIS to select the optimum general structure for each design.
AMIS engineers can develop new arrays if needed.
Customisation of array structures through the design of the interconnect layers offers shortened design process time and significantly reduced cost.
When the theoretical design has been completed, it is created as a breadboard prototype using kit parts to prove its accurate alignment with customer performance specifications.
Following this stage, the evolution of the design into silicon can be carried out with a high-degree of confidence.
With mask tooling only being required for the interconnect layers, the cost and time taken to move from breadboard to silicon is minimal.
Should changes in specification necessitate design respins, the nature of the analogue array process allows these to be completed in an impressive turnaround time of approximately six weeks versus the turn around time of a traditional mixed-signal ASIC of 12 to 18 months.
Corey Hatcher, Director of Analog Arrays at AMI Semiconductor said: "Using proven, existing blocks of circuitry results in significant benefits for our customers by simplifying and reducing the cost of developing mixed-signal ASICs for their applications".
"With the customisation of each IC achieved through the design and processing of the interconnect layers only, we can deliver product with remarkably low NREs and very short lead times".
AMIS has in-house capabilities for testing analogue array devices at both wafer and packaging levels.
Customised test programs can be developed to meet the specific needs of individual customer applications.
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