Product category:
Power Supply ICs and Controllers
News Release from: AMI Semiconductor | Subject: Smart Power
Edited by the Electronicstalk Editorial
Team on 17 November 2006
Automotive power devices take Flash
onboard
AMI Semiconductor can now offer automotive grade embedded Flash technology for its 0.35um Smart Power high-voltage mixed-signal SoC process technology.
AMI Semiconductor can now offer automotive grade embedded Flash technology for its 0.35um Smart Power high-voltage mixed-signal system-on-chip (SoC) process technology The combination of the proven CMOS mixed-signal technology and the robust new nonvolatile memory (NVM) allows designers to create cost-effective smart sensor interfaces, intelligent actuators and other sophisticated single-chip devices for operation in automotive, industrial, appliance and other harsh environment applications
This article was originally published on Electronicstalk on 30 Sep 2002 at 8.00am (UK)
Related stories
ASIC technology provides smart power SoCs
A new ASIC technology enables the delivery of the industry's first 0.35um CMOS smart power SoC solutions for voltages up to 80V.
Deep trench isolation shrinks smart power SoCs
A new high-voltage mixed-signal technology reduces component count and cost and delivers high-density ASICs with chip areas that are up to 40% smaller than previous SoC solutions.
AMI Semiconductor's latest High Injection MOS (HiMOS) embedded memory IP and technology provide designers with the flexibility to configure the sise of the onboard Flash memory capacity from 2 to 64Kbyte in target applications expected to operate in harsh conditions.
Memory can be delivered in single-bank or dual-bank configurations with memory retention for code storage of up to 15 years.
Single-bank configurations can provide up to 64Kbyte of code storage.
Further reading
Smart power design kits come on CD-ROM
AMI Semiconductor is now able to offer access to its I3T80 high-voltage smart-power technology through CD-ROM based design kits.
EEPROM module joins smart power process
AMI Semiconductor (AMIS) is developing an EEPROM module based on its 0.35um (I3T) smart power technology.
Smart power ASIC process cuts on-resistance
AMI Semiconductor has enhanced its I2T100 Smart Power mixed-signal semiconductor technology by significantly reducing transistor on-resistance performance.
The dual-bank option allows code storage up to 62Kbyte and data storage of 2Kbyte, emulating an EEPROM capable of a minimum of 10,000 erase cycles.
In addition to providing Flash functionality in the final product, HiMOS NVM can also be used for rapid development and prototyping, prior to shrinking to a ROM-based solution for final manufacture.
Sector and multiple sector erase time is 0.5s, and page programming takes just 20us (with 32-pages per sector).
Random access read time is 100ns for either 8 or 16bit words.
The memory is fully qualified to the AEC-Q100 critical stress test for automotive electronic components.
Capable of operation to 80V, AMI Semiconductor's 0.35um CMOS-based mixed-signal technology allows system designers to reduce component count, save space, and lower costs through ICs that integrate high-density digital circuits, high-voltage circuitry and high-precision analogue blocks.
The automotive grade embedded HiMOS Flash memory offers a cost-effective route to reliable on-chip code and data storage and will operate at temperatures from -40 to +125C.
The memory can also continue to provide read functionality at temperatures as high as 150C.
AMI Semiconductor's mixed-signal Smart Power ICs can incorporate a wide variety of digital, analogue and high-voltage functions including processors, communication interfaces, bus protocol controllers and interfaces for CAN and LIN connectivity, high-voltage functions such as motor control drivers and DC/DC convertors, and analogue blocks including filters, ADCs and DACs.
Because the AMIS HiMOS Flash is implemented using only three additional mask layers to the base technology mask set, intelligent, smart power Flash-based ICs provide a highly cost-effective alternative to discrete and other SoC alternatives.
AMI Semiconductor's embedded Flash memory process and custom design service provide benefits to users such as memory sized to specific needs, and supply of SoCs with integrated HiMOS Flash memory for the lifetime of a project; in automotive and industrial applications this can be 10 years or more.
This protects against the risk of needing to periodically requalify a design due to the phasing out of current technology in favour of newer approaches, a problem that often occurs when using stand-alone nonvolatile memory.
To help speed development of applications based on the latest mixed-signal and NVM technology, AMIS also offers an emulation board and mixed-signal test ICs for designers to develop and debug their software in parallel to hardware development.
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