Wafer bonders buck the trend

On the MEMS equipment supply side AML is experiencing a boom period with sales of wafer bonding machines all over the world - USA, Far East, Taiwan, India, and Europe.

On the MEMS equipment supply side AML is experiencing a boom period with sales of wafer bonding machines all over the world - USA, Far East, Taiwan, India, and Europe.

In these tough times, value for money, reliability, low cost of ownership and good machines built for purpose are obviously appreciated.

After the founder's first custom wafer bonding machine, built in 1985 (before the competition) AML was encouraged a few years ago to also sell "off the shelf" machines by many disgruntled customers in the industry and break the monopoly situation that existed.

Rob Santilli of AML says: "Industry has kept its word and backed us, which is pleasing.

Our arrival and competition in the main stream, "off the shelf" market, has prompted severe price-cutting by our competitor.

In contrast AML's prices have not changed because they were right first time, and we are still cheaper and better".

MEMS is maturing as an industry and this means that dedicated MEMS equipment is required.

The days of modified mask aligners for wafer bonding are over and the MEMS community demands and deserves dedicated MEMS equipment.

Tony Rogers, Technical Director at AML, says: "Why compromise when you can get the job done properly and at reasonable price".

Wafer bonding and DRIE (deep reactive ion etching) are two MEMS processes, key to the ever-increasing need to realise real 3D MEMS devices.

The DRIE side has necessitated dedicated equipment and has benefited greatly from this.

The availability of dedicated wafer bonding equipment means that the bonding side can now make a similar impact.

Rogers says: "Keep your mask aligner for what it's good at, and if you need wafer bonding, then use equipment that bonds wafers".

Rob Santilli adds: "As a long standing MEMS company, we are also well placed to predict and satisfy future MEMS equipment requirements".

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