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Electronics Manufacturing Services
News Release from: Applied Microengineering
Edited by the Electronicstalk Editorial
Team on 15 December 2005
University in China buys wafer bonding
machine
After breaking into the German market with a sale to Fraunhofer IZM earlier this year, Applied Microengineering has now delivered an Aligner-Wafer bonding machine to Xiamen University in China.
After breaking into the German market with a sale to Fraunhofer IZM earlier this year, Applied Microengineering has now delivered an Aligner-Wafer bonding machine to Xiamen University in China Rob Santilli Director of AML declared: "We now have machines in almost every major industrialised country, including UK, France, Germany, Holland, Denmark, Ireland, USA, Japan, Korea, India, Taiwan and China"
This article was originally published on Electronicstalk on 27 Mar 2000 at 8.00am (UK)
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The design-house/foundry model for the fabrication of MEMS devices that his company has been pursuing for a number of years simply does not work, says AML's Rob Santilli.
All this follows the recent announcement that AML is now the key wafer bonding centre node in the new multimillion pound UK MNT infrastructure with investment in facilities to aid the development of new bonding and associated processes, an applications database, training and technology transfer.
This will support the wafer bonding service provided by AML on a global basis.
AML's equipment arm also ensures that machines able to run the new bonding processes developed can be made available to industry.
Santilli added: "This further demonstrates how different we are to our major competitor who is basically just an engineering company".
AML feels that internal R and D and the development of processes is an integral part of being a wafer bonding company.
It says that it gives it quite a big edge to the extent that customers now prefer to pay for its machines than receive an almost free one from our competitors.
Tony Rogers, Technical director said: "The increased sales show that the MNT industry now recognises that AML's unique technology of in-situ align and bond is the industry's preferred method for aligned wafer bonding".
Nick Aitken, AML's Senior Applications Engineer also added: "AML is in a unique position to offer consultancy, process development and low volume production runs to emerging and established optoelectronic and MEMS companies as well as research institutions".
"Given the ever increasing diversity in optoelectronic materials and MEMS device requirements, AML's ability to take the risk out of the packaging development and deliver a working process along with proven bonding equipment, will be of benefit to the industry as a whole".
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