SDRAM upgrades to 16Mbit density

Edited by the Electronicstalk editorial team Apr 12, 2006

A next-generation 16Mbit SDRAM is produced using an all-new 0.14um trench technology that offers die sizes comparable with traditional 0.11um technology but with vastly improved performance.

Taiwan-based memory designer Amic Technology Corp has released its next generation SDRAM; the A43L0616B is a 1M x 16bit SDRAM design for the coming years.

"With the new DSP and microcontroller circuitry offered in the market today the 16Mbit SDRAM offers an excellent density upgrade and a unique price/performance for our customers", says Gary Chen, Marketing Director.

This new and smaller die based 16Mbit (1M x 16bit) SDRAM is produced using an all-new 0.14um trench technology that offers die sizes comparable with traditional 0.11um technology but with vastly improved performance versus power consumption.

The A43L0616B has a novel wafer level burn-in feature to enhance the reliability performance in all applications, including die based solutions.

The A43L0616B is available as die and in TSOP packaging.

The following TSOP versions are already available: the A43L0616BV-7F, 143MHz (commercial temperature 0 to +70C); the A43L0616BV-6F, 166MHz (commercial temperature); and the A43L0616BV-7UF, 143MHz (Industrial temperature -40 to +85C).

The A43L0616B is designed for 3.3V applications.

Another version suitable for use with supplies down to 1.8V is due later this year.