CMOS switch shrinks to true chip-sized package

Edited by the Electronicstalk editorial team Apr 2, 2003

The ADG819 is the first IC from Analog Devices to be offered in "wafer-level", or die-size packaging, which is a true CSP (chip-size package) because it has no plastic coating.

The ADG819 is the first IC from Analog Devices to be offered in "wafer-level", or die-size packaging, which is a true CSP (chip-size package) because it has no plastic coating.

This monolithic, single-pole, double-throw CMOS switch can be mounted directly on a board for critical space savings key to high-density electronic applications, such as cellular handsets and PDAs.

In addition, its low power consumption and wide operating supply range of 1.8 to 5.5V make the device ideal for battery-powered portable instruments.

The ADG819 conducts equally well in both directions and exhibits break-before-make switching action, which prevents momentary shorting when switching channels.

Now available in die-size packaging, the part is priced at $0.93 per unit in 1000-piece quantities.