Product category:
Analogue and Mixed Signal ICs
News Release from: Analog Devices | Subject: ADG12xx and ADG14xx switches
Edited by the Electronicstalk Editorial
Team on 12 November 2004
Process technology delivers lowest
distortion
Analog Devices has introduced a series of switches and multiplexers that operate at +/- 15 V while delivering very low capacitance and low on -resistance in small packaging.
Analog Devices, a global leader in high-performance semiconductors for signal-processing applications, today introduced a series of switches and multiplexers that operate at +/- 15 V while delivering very low capacitance and low on -resistance in small packaging Manufactured on Analog Devices' iCMOS industrial process technology, these devices represent a quantum leap in performance over traditional switch solutions
This article was originally published on Electronicstalk on 2 Jul 2008 at 8.00am (UK)
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Data acquisition and measurement applications will benefit greatly from the very low capacitance of the ADG12xx series.
The low on-resistance flatness of the ADG14xx series will be of great benefit to designers requiring accurate gain setting or low power relay replacement.
The ADG12xx switches and multiplexers offer the lowest capacitance per channel (2 pF), providing higher speeds and faster acquisition times in the sample-and-hold and gain-selection sections of data-acquisition boards.
This tiny capacitance eliminates concerns over spurious glitches that cause increased settling time, speeding up the design cycle and improving field robustness.
The ADG14xx multiplexers offer low on -resistance that is 85 percent lower than the nearest competitor - featuring a maximum 5-ohm on-resistance over the full signal range, significantly reducing signal loss through the switch, and enabling higher accuracy measurements in applications, such as gain switching networks and relay replacements, where low distortion is critical to reliable, predictable circuit performance.
The ADG12xx and ADG14xx switches and multiplexers are now sampling and scheduled for full production in February 2005.
The products are available in TSSOP (thin shrink small outline package) and LFCSP (lead frame chip scale package) packaging.
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