Product category:
Intellectual Property Cores
News Release from: ARM
Edited by the Electronicstalk Editorial
Team on 24 January 2007
Interconnect technology aids wireless
development
Broadcom licenses PrimeCell high-performance Amba 3 AXI interconnect technology along with the Amba Designer tool for next generation on-chip bus development.
Broadcom Corp has licensed ARM's PrimeCell high-performance Amba 3 AXI interconnect technology (PL301), along with the Amba Designer tool, for next generation on-chip bus development involving wireless and mobile platforms "At Broadcom we are constantly growing and extending our technology base in order to best address existing and new markets"
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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"The Amba AXI specification, coupled with the versatility of ARM configurable PrimeCell infrastructure IP, helps us optimise system performance across a wide spectrum of applications", said Dr Edward Frank, Corporate Vice President of Research and Development for Broadcom.
"Further, ARM's ability to deliver significant IP, including high performance on-chip interconnect, together with ARM's strong commitments to support Broadcom's needs, are helping us decrease time to market for an increasing number of important products".
"This Broadcom licence represents a significant milestone in the continuing expansion of the ARM Fabric Business Unit's market share", said Jonathan Morris, General Manager, Fabric BU, ARM.
"This design win with a communications industry leader underlines a key value that we bring to our Partners: a complete on-chip communications fabric, all architected around a single de facto standard - Amba interconnect technology".
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