Product category:
Design and Development Software
News Release from: Ansoft Europe | Subject: ParICs version 3.1
Edited by the Electronicstalk Editorial
Team on 14 February 2001
Automated modeling for IC packaging
Ansoft has announced a new release of ParICs, version 3.1, one of Ansoft's Signal Integrity software tools.
Ansoft has announced a new release of ParICs, version 3.1, one of Ansoft's Signal Integrity software tools ParICs offers a unique mix of automation, design flexibility, and ease of use for allowing a large number of different IC package types to be modelled in either Maxwell Spicelink or Ansoft HFSS
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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High-frequency simulation adds Spice to comms
Ansoft has announced version 8.0 of the Ansoft High Frequency Structure Simulator (Ansoft HFSS).
As signals with higher frequencies and faster edge rates become more prevalent, IC packages are forced to carry these signals.
This requires the ability to quickly and easily model these common, cost-effective packages for high frequency and high-speed signal integrity issues.
Easy specification of the packages physical parameters in ParICs allow users to quickly and easily determine the optimum packaging solution for today's high frequency design.
The ParICs tool has now been ported to run on Windows NT and has been integrated into Ansoft's Maxwell Control Panel.
The license management now supports FLEXLM, and online documentation has been added.
"With increasingly fast edge rates and higher frequencies being used in digital, RF and optical design, advanced modelling of the large number of commonly used IC packages has taken on a critical significance", said Jonathan Smith, Product Marketing Manager for Signal Integrity Products.
ParICs allows users to quickly and easily model popular leaded IC package types such as PQFPs.
Ansoft HFSS is a full-wave finite element electromagnetic simulator that enables engineers to design three-dimensional high-frequency structures such as connectors, IC packages, and antennas found in cellular telephones, broadband communications systems, and microwave circuits.
Version 8.0 contains the Full-Wave Spice model export and links to version 2.0 of Ansoft's optimisation and parametrics module Optimetrics.
Maxwell Spicelink is a suite of tools composed of Maxwell 2D Extractor, Maxwell Q3D Extractor, a GUI based schematic capture tool, and Maxwell Spice.
A complete range of interconnects can be analysed with these tools.
Spice models can be created and simulated for uniform transmission lines with Maxwell 2D Extractor.
Discontinuities, such as wire bonds, package leads, connectors, vias, and crossovers, can be modelled and simulated with Maxwell Q3D Extractor.
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