Product category:
Design and Development Software
News Release from: Ansoft Europe | Subject: PCB/MCM Signal Integrity V3.7
Edited by the Electronicstalk Editorial
Team on 28 March 2001
3D modelling aids high-speed PCB design
Ansoft has announced version 3.7 of its PCB/MCM Signal Integrity (SI) tools.
Ansoft has announced version 3.7 of its PCB/MCM Signal Integrity (SI) tools The high-performance sector of the PCB design industry is increasingly relying on extremely fast edge rates to drive next-generation designs
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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PCB/MCM SI is claimed to be the only signal integrity tool that addresses the high-speed/high-performance PCB needs for optical networks, memory interfaces, and multi-gigabit transmission systems.
"PCB/MCM SI's 3D extraction engine allows designers to address complex design problems such as power and ground bounce, simultaneous switching output (SSO) noise, and parasitic extraction (R, L, C, G) for any 3D structure on the PCB", said Jonathan Smith, Product Marketing Manager for Signal Integrity Products.
"Today's leading-edge digital designs absolutely require 3D modelling on the PCB level.
Behavioural drivers/receiver models combined with only two-dimensional (2D) extraction engines can no longer suffice for these designs".
PCB/MCM Signal Integrity has interfaces that allow it to automatically read-in and characterise an entire PCB or MCM designed in Cadence's Allegro or Mentor Graphics' BoardStation.
During the analysis, the designer can choose whether to analyse particular structures and nets in full 3D or a mixed 2D and 3D solution.
Any type of non-ideal power or ground plane (partial plane, split plane, random holed or meshed plane) can be analysed.
PCB/MCM can also analyse single-chip, few chip, or multichip (system-on-package) designs from Cadence's Advanced Package Designer.
PCB/MCM Signal Integrity uses the Partial Element Equivalent Circuit (PEEC) method to produce a distributed 3D models.
The PEEC method allows the tool to create extremely accurate models of very high-speed traces such as differential pairs and source-synchronous data lines.
The distributed nature of the PEEC model allows the effect of each individual interconnect structure (including the effect of the non-ideal ground planes) on the signal to be seen in SPICE.
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