Product category:
Design and Development Software
News Release from: Ansoft Europe | Subject: Turbo Package Analyser V4
Edited by the Electronicstalk Editorial
Team on 28 June 2001
Analysis stretched to latest IC packages
Ansoft has upgraded its advanced semiconductor packaging design tool, Turbo Package Analyser (TPA).
Ansoft has upgraded its advanced semiconductor packaging design tool, Turbo Package Analyser (TPA) With this new release, TPA automates the analysis of all complex semiconductor packages, including flip-chip, chip scale package, and multiple die system-in-package designs
This article was originally published on Electronicstalk on 10 Mar 2008 at 8.00am (UK)
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"With the rapid proliferation of packages with high pin counts, designers need automated analysis tools", said Jonathan Smith, Product Marketing Manager, Signal Integrity Products.
"TPA 4.0 provides capabilities that allow the design of advanced packages in real time with exceptional accuracy".
Version 4 of TPA includes an industry first, multipole-accelerated partial element equivalent circuit (multi-PEEC) engine and an advanced model reduction algorithm for ultrafast simulations of high-speed traces.
The multi-PEEC engine allows long leads carrying high speed signals to be modelled using distributed circuits for greater accuracy.
The model reduction algorithm simplifies these distributed circuits by orders of magnitude to speed subsequent time-domain simulation in Spice.
Enabling seamless work flow for high performance semiconductor package designers, TPA supports interfaces to automatically characterise an entire package that has been initiated in Cadence's Advanced Package Designer (APD), Avant!'s Encore IC Package Designer and Zuken's CR5000 advanced packaging solution.
3D analysis provided by TPA's extraction engine can solve any BGA package structure, including wirebonds, pads, vias, tapered traces, solder balls, and non-ideal power and ground structures.
And for crosstalk simulations, TPA can automatically produce a multiconductor coupled RLC model for each lead in the package.
The user specifies the number of adjacent or nearby leads for coupling and the program automatically calculates all of the coupling values.
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