Product category:
Design and Development Software
News Release from: Ansoft Europe | Subject: TPA 4.0
Edited by the Electronicstalk Editorial
Team on 27 February 2002
Package analysis software takes in
latest styles
Turbo Package Analyser (TPA) 4.0 from Ansoft is an advanced software tool that automates the analysis of all complex semiconductor packages.
Turbo Package Analyser (TPA) 4.0 from Ansoft is an advanced software tool that automates the analysis of all complex semiconductor packages The new version of TPA, which can analyse flip-chip, chip-scale package, and multiple-die system-in-package designs common in the networking and broadband communications markets, includes an industry-first, multipole-accelerated partial element equivalent circuit (multi-PEEC) engine and an advanced model reduction algorithm for ultra-fast simulations of high-speed traces
This article was originally published on Electronicstalk on 10 Mar 2008 at 8.00am (UK)
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Using distributed circuits for greater accuracy, the multi-PEEC engine allows engineers to model long traces carrying high-speed signals.
The model reduction algorithm simplifies the distributed circuits by orders of magnitude to speed subsequent time-domain simulation in Spice.
"Our beta test period for TPA 4.0 has been very successful", said Jonathan Smith, Ansoft's Product Marketing Manager, Signal Integrity Products.
"The list of beta customers included such well-known companies as Amkor, Micron, Nvidia, AMCC, ChipPAC, Agere Systems, Motorola, and VLSI/Philips, and we thank them for their contributions to our software-release process".
TPA fully characterises an entire package structure and automatically produces accurate lumped or distributed RLC (resistance, inductance and capacitance) values for any trace or coupled groups of traces.
Providing designers with a seamless workflow, the software generates RLC models directly from leading package layout tools, such as Cadence Advanced Package Designer (APD), Avanti Encore IC Package Designer and Suken's CR-5000 advanced packaging solution.
The new version automates crosstalk analysis for any type of BGA package structure, including wire bonds, pads, vias, tapered traces, solder balls, and nonideal power and ground structures.
The user simply specifies the number of adjacent or nearby traces for coupling, and TPA automatically calculates all of the coupling values.
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