Product category:
Design and Development Software
News Release from: Ansoft Europe
Edited by the Electronicstalk Editorial
Team on 07 March 2003
User workshop presentations available
online
Design experts from around the world came together in Los Angeles, California, for Ansoft Corp's sixth annual HFSS users workshop.
Design experts from around the world came together in Los Angeles, California, for Ansoft Corp's sixth annual HFSS users workshop The event featured several Ansoft and customer presentations outlining how HFSS can help shorten design-cycle time and optimise device performance
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
Related stories
IC packaging partnership proves a success
IC packaging leader Advanced Semiconductor Engineering has announced its commitment to Ansoft's HFSS, Q3D Extractor and AnsoftLinks simulation products for IC packaging design and model extraction.
High-frequency simulation adds Spice to comms
Ansoft has announced version 8.0 of the Ansoft High Frequency Structure Simulator (Ansoft HFSS).
HFSS is industry-standard design-automation software that engineers use to analyse electromagnetic fields in microwave components and systems, integrated circuits, circuit boards, antennas and other high-frequency technology.
"I enjoyed the conference", said Greg Surbeck, a user-presenter from Ditrans Corp.
"I immediately went back to work and applied new techniques I learned there.
It was time well spent".
Dr Zoltan Cendes, Ansoft's Chairman and Chief Technology Officer, said, "I was impressed with the high quality of the user presentations.
Our customers are using HFSS to address novel design issues well beyond the scope of what can be discovered with measurements alone.
It is encouraging to see so many of our customers benefit from the exchange of ideas among each other".
Representatives from the following companies presented technical material at the workshop: Tektronix - "High-speed package design with HFSS v9.0"; Vitesse Semiconductor - "HFSS interconnect models in high-speed IC design flow"; Amkor Technology - "Investigation of the effects of ground vias, solder balls, and wires in high-speed packages"; Intel - "Interconnect, packaging, and EMI issues for next-generation data rates"; Ditrans - "Design of a custom PCB for RF receiver system in package (SiP) test"; Kyocera America - "Designing an X-band T/R module package"; SLAC - "Study of the effect of high RF magnetic fields on multi-megawatt RF-breakdown"; Raytheon - "HFSS design and measurement verification of a variety of antennas"; Motorola - "Multi-pitch, broadband helical antenna design"; Anaren Microwave - "Temperature-stable design of microwave circulators using HFSS and Maxwell"; SLAC - "Periodic transmission line dipole mode study in RF cavities for high-energy accelerators".
All presentations from the event can be downloaded from the Ansoft website.
• Ansoft Europe: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
