Package design links with 3D EM simulation

Edited by the Electronicstalk editorial team Jul 15, 2005

Turbo Package Analyzer combines new bidirectional integration with Synopsys' Encore package-design software with Ansoft's state-of-the-art 3D electromagnetic simulation.

The latest version of the Ansoft Turbo Package Analyzer (TPA v4.2) combines new bidirectional integration with Synopsys' Encore package-design software with Ansoft's state-of-the-art 3D electromagnetic simulation.

It enables full parasitic extraction of complex IC packages, such as ball-grid arrays (BGAs).

"As a result of our close collaboration, Ansoft's advanced electromagnetic technology for package extraction and characterisation can be accessed directly from our Encore product today", said Kevin Rinebold, Synopsys' Senior Technical Marketing Manager, Packaging Products.

"Our work with Ansoft further advances the state of the art in package planning and design by integrating Ansoft's latest capabilities with our IC/package codesign environment".

With AnsoftLinks, a tool for simplifying data import and export between EDA and CAD packages, TPA v4.2 will generate resistance, inductance and capacitance (RLC) models directly from popular package design tools.

It accepts CAD data and fully characterises the entire package in three dimensions.

The 3D analysis provided by the TPA v4.2 extraction engine can solve any BGA package structure, including wirebonds, pads, vias, tapered traces, solder balls and nonideal power and ground structures.

For crosstalk simulations, TPA v4.2 automatically provides a multiconductor coupled RLC model for each lead in the package.

The user specifies the number of nearby (adjacent) leads for coupling, and the program automatically calculates all of the parasitics.

TPA v4.2 is available for Windows and Sun/Solaris.